A technique for monitoring the consistency of package geometry and dielectric constant in the manufacturing process

Author

Stys, Diane ; Bhattacharyya, Bidyut K.

Author_Institution

Intel Corp., Chandler, AZ, USA

fYear

1988

fDate

9-11 May 1988

Firstpage

59

Lastpage

63

Abstract

A method for detecting the variation in geometry among vendors, lots and individual packages is presented. Using this method, the capacitance between two conductors (traces, leads) is measured with the remaining conductors in the package left floating. The package capacitance lies in the range of 1 pF to 400 pF, depending on the geometry of the conductors, and can be measured with an accuracy within 0.05 pF. This permits the study of variations in the capacitance value for the same lead pairs of many packages and different vendors. The standard deviation, calculated from a sample size of 50, is in the range of 1 pF to 7 pF, which indicates that this measurement technique and methodology can be used with state-of-the-art package technology.<>

Keywords

inspection; monolithic integrated circuits; packaging; quality control; 1 to 400 pF; capacitance between two conductors; consistency of package geometry; dielectric constant; lead pairs; lot to lot variation; manufacturing process; monitoring; package capacitance; package variation; sample size; state-of-the-art package technology; variation in geometry; vendor variation; Capacitance measurement; Conducting materials; Dielectric constant; Dielectric materials; Electrical resistance measurement; Geometry; Monitoring; Packaging; Roentgenium; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Components Conference, 1988., Proceedings of the 38th

Conference_Location

Los Angeles, CA, USA

Type

conf

DOI

10.1109/ECC.1988.12570

Filename

12570