Title :
A technique for monitoring the consistency of package geometry and dielectric constant in the manufacturing process
Author :
Stys, Diane ; Bhattacharyya, Bidyut K.
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
A method for detecting the variation in geometry among vendors, lots and individual packages is presented. Using this method, the capacitance between two conductors (traces, leads) is measured with the remaining conductors in the package left floating. The package capacitance lies in the range of 1 pF to 400 pF, depending on the geometry of the conductors, and can be measured with an accuracy within 0.05 pF. This permits the study of variations in the capacitance value for the same lead pairs of many packages and different vendors. The standard deviation, calculated from a sample size of 50, is in the range of 1 pF to 7 pF, which indicates that this measurement technique and methodology can be used with state-of-the-art package technology.<>
Keywords :
inspection; monolithic integrated circuits; packaging; quality control; 1 to 400 pF; capacitance between two conductors; consistency of package geometry; dielectric constant; lead pairs; lot to lot variation; manufacturing process; monitoring; package capacitance; package variation; sample size; state-of-the-art package technology; variation in geometry; vendor variation; Capacitance measurement; Conducting materials; Dielectric constant; Dielectric materials; Electrical resistance measurement; Geometry; Monitoring; Packaging; Roentgenium; Testing;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA, USA
DOI :
10.1109/ECC.1988.12570
