DocumentCode
2444917
Title
Sizing of back-surface flaws by piezoelectric highpolymer film
Author
Yamamoto, Akinobu ; Biwa, Shiro ; Matsumoto, Eiji
Author_Institution
Dept. of Energy Conversion Sci., Kyoto Univ., Kyoto
fYear
2008
fDate
Nov. 30 2008-Dec. 3 2008
Firstpage
508
Lastpage
513
Abstract
Piezoelectric thin film has been used to visualize back surface flaws in plates. If the plate with a surface flaw is deformed, the strain distribution appears on the other surface reflecting the location and the shape of the flaw. Such surface strain distribution can be transformed into the electric potential distribution on the piezoelectric film mounted on the plate surface. The purpose of this paper is to estimate the size of a back-surface flaw from the electric potential distribution. The numerical simulation of this technique for various sizes of flaws implies that the depth and the width of the surface flaw are related together with the height and the width of the potential peak. From the experimental verification on acrylic specimens with surface flaws, it is observed that the flaw depth can be exactly estimated but the width can not be.
Keywords
electric potential; piezoelectric thin films; piezoelectricity; polymer films; back-surface flaws sizing; electric potential distribution; piezoelectric highpolymer film; piezoelectric thin film; plate surface; strain distribution; visualize back surface flaws; Capacitive sensors; Electric potential; Inspection; Maxwell equations; Notice of Violation; Piezoelectric films; Piezoelectric materials; Shape; Strain measurement; Tensile stress; electric potential; piezoelectricity; polyvinylidene fluoride (PVDF); sensor; strain distribution;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensing Technology, 2008. ICST 2008. 3rd International Conference on
Conference_Location
Tainan
Print_ISBN
978-1-4244-2176-3
Electronic_ISBN
978-1-4244-2177-0
Type
conf
DOI
10.1109/ICSENST.2008.4757158
Filename
4757158
Link To Document