• DocumentCode
    2444917
  • Title

    Sizing of back-surface flaws by piezoelectric highpolymer film

  • Author

    Yamamoto, Akinobu ; Biwa, Shiro ; Matsumoto, Eiji

  • Author_Institution
    Dept. of Energy Conversion Sci., Kyoto Univ., Kyoto
  • fYear
    2008
  • fDate
    Nov. 30 2008-Dec. 3 2008
  • Firstpage
    508
  • Lastpage
    513
  • Abstract
    Piezoelectric thin film has been used to visualize back surface flaws in plates. If the plate with a surface flaw is deformed, the strain distribution appears on the other surface reflecting the location and the shape of the flaw. Such surface strain distribution can be transformed into the electric potential distribution on the piezoelectric film mounted on the plate surface. The purpose of this paper is to estimate the size of a back-surface flaw from the electric potential distribution. The numerical simulation of this technique for various sizes of flaws implies that the depth and the width of the surface flaw are related together with the height and the width of the potential peak. From the experimental verification on acrylic specimens with surface flaws, it is observed that the flaw depth can be exactly estimated but the width can not be.
  • Keywords
    electric potential; piezoelectric thin films; piezoelectricity; polymer films; back-surface flaws sizing; electric potential distribution; piezoelectric highpolymer film; piezoelectric thin film; plate surface; strain distribution; visualize back surface flaws; Capacitive sensors; Electric potential; Inspection; Maxwell equations; Notice of Violation; Piezoelectric films; Piezoelectric materials; Shape; Strain measurement; Tensile stress; electric potential; piezoelectricity; polyvinylidene fluoride (PVDF); sensor; strain distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensing Technology, 2008. ICST 2008. 3rd International Conference on
  • Conference_Location
    Tainan
  • Print_ISBN
    978-1-4244-2176-3
  • Electronic_ISBN
    978-1-4244-2177-0
  • Type

    conf

  • DOI
    10.1109/ICSENST.2008.4757158
  • Filename
    4757158