DocumentCode
2444980
Title
Development and test of an X/KU band tile technology multi-link antenna system for CDL communications
Author
Brukiewa, T.F. ; Cho, C. ; Jenabi, M. ; Qintero, C.
Author_Institution
ITT Industries, Van Nuys, CA, USA
fYear
2003
fDate
14-17 Oct. 2003
Firstpage
423
Lastpage
428
Abstract
The development and tested performance of a multiple beam tile-based active phased array for wideband CDL/TCDL military communications applications is described. Work is performed under contract to Naval Surface Warfare Center, Dahlgren, VA. The program objective is to develop the multiple link antenna system (MLAS) hardware/software and demonstrate its military utility through an advanced concept technology demonstration (ACTD). MLAS is a compact, active phased array antenna supporting four simultaneous high data rate (274 Mbit/sec, minimum), full duplex channels utilizing highly integrated, wide bandwidth gallium arsenide (GaAs) chip technology. The ACTD MLAS antenna hardware consists of a 256-element transmit array and a 256-element receive array. Each array provides 4 beams that are independently scanned electronically; Circular or linear polarization of any orientation is independently selectable for each beam. The design architecture, measured performance results, and potential applications are presented.
Keywords
antenna phased arrays; military communication; multibeam antennas; receiving antennas; telecommunication links; transmitting antennas; CDL communications; GaAs; Naval Surface Warfare Center; TCDL military communications applications; X/KU band tile technology multilink antenna system; active phased array antenna; advanced concept technology demonstration; common data links; design architecture; gallium arsenide chip technology; linear polarization; receive array; transmit array; Antenna arrays; Application software; Contracts; Gallium arsenide; Hardware; Military communication; Phased arrays; System testing; Tiles; Wideband;
fLanguage
English
Publisher
ieee
Conference_Titel
Phased Array Systems and Technology, 2003. IEEE International Symposium on
Print_ISBN
0-7803-7827-X
Type
conf
DOI
10.1109/PAST.2003.1257019
Filename
1257019
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