Demonstration of a micro-CPL based on MEMS fabrication technologies

Author

Kirshberg, Jeffrey ; Yerkes, Kirk L. ; Liepmann, Dorian

Author_Institution

Dept. of Mech. Eng., California Univ., Berkeley, CA, USA

Volume

2

fYear

2000

fDate

2000

Firstpage

1198

Abstract

Utilizing current micro electro mechanical systems (MEMS) technologies, a three-port microcapillary pumped loop (micro-CPL) was designed, fabricated and tested to provide integral cooling to electronics or MEMS type devices. The two wafer design consists of one silicon and one borofloat glass wafer. An analytical study was used in determining the geometry of the device, including the evaporator dimensions (1000 μm×2000 μm) and the length of the liquid and vapor lines (35 mm). Using laser spot heating, the finished device was run near steady-state. It was determined that a laser delivering 8.5 W (+/-0.2 W) with a spotsize diameter of 3.5 mm caused dry-out of the micro-CPL

Keywords

cooling; heat sinks; micromechanical devices; 1000 mum; 2000 mum; 3.5 mm; 35 mm; 8.5 W; MEMS fabrication technologies; borofloat glass wafer; electronics; evaporator dimensions; integral cooling; laser spot heating; liquid line length; micro electro mechanical systems; micro-CPL; silicon wafer; three-port microcapillary pumped loop; two wafer design; vapor line length; Electronic equipment testing; Electronics cooling; Fabrication; Geometrical optics; Glass; Heating; Mechanical systems; Micromechanical devices; Silicon; System testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Energy Conversion Engineering Conference and Exhibit, 2000. (IECEC) 35th Intersociety

Conference_Location

Las Vegas, NV

Print_ISBN

1-56347-375-5

Type

conf

DOI

10.1109/IECEC.2000.870931

Filename

870931