DocumentCode
2448320
Title
Analytical calculation of current and voltage stresses of Two-Stage Matrix Converter’s power semiconductors
Author
Hamouda, Mahmoud ; Fnaiech, Farhat ; Al-Haddad, Kamal
Author_Institution
Equipe SICISI, Ecole Suprieure des Sci. et Tech. de Tunis, Tunis
fYear
2008
fDate
10-13 Nov. 2008
Firstpage
561
Lastpage
566
Abstract
The currentpsilas path through the power semiconductors of matrix converters depends inherently on the load side displacement factor. In principle, two particular cases should be investigated. They correspond to a lagging/leading output displacement angle lower and superior to pi/6 respectively. This paper determines new analytical expressions of the current and voltage stresses of two-stage matrix converterpsilas power semiconductors for a load side lagging/leading displacement angle less than pi/6. The first novelty in the proposed approach is that any assumption which decouples the two stages is adopted. The second one is that the proposed formulas are not restricted to the case of unity input displacement factor i.e. they are available for a variable IDF operation. Besides the well known influence of the input displacement factor on the reactive power demanded from the utility and the maximum achievable voltage transfer ratio, it is shown that this factor also affects the current stress on the power semiconductors. A comparative study carried out between the results of analytical computations and those of numerical simulations shows that the two methods agree well and emphasizing thus the effectiveness and accuracy of the proposed analytical expressions.
Keywords
matrix convertors; power semiconductor devices; current stress; power semiconductors; two-stage matrix converter; voltage stress; Energy conversion; Lead compounds; Matrix converters; Performance analysis; Power electronics; Power semiconductor switches; Reactive power; Stress; Topology; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics, 2008. IECON 2008. 34th Annual Conference of IEEE
Conference_Location
Orlando, FL
ISSN
1553-572X
Print_ISBN
978-1-4244-1767-4
Electronic_ISBN
1553-572X
Type
conf
DOI
10.1109/IECON.2008.4758015
Filename
4758015
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