Title :
Factorized Similarity Learning in Networks
Author :
Shiyu Chang ; Guo-Jun Qi ; Aggarwal, Charu C. ; Jiayu Zhou ; Meng Wang ; Huang, Thomas S.
Author_Institution :
Beckman Inst., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Abstract :
The problem of similarity learning is relevant to many data mining applications, such as recommender systems, classification, and retrieval. This problem is particularly challenging in the context of networks, which contain different aspects such as the topological structure, content, and user supervision. These different aspects need to be combined effectively, in order to create a holistic similarity function. In particular, while most similarity learning methods in networks such as Sim Rank utilize the topological structure, the user supervision and content are rarely considered. In this paper, a Factorized Similarity Learning (FSL) is proposed to integrate the link, node content, and user supervision into an uniform framework. This is learned by using matrix factorization, and the final similarities are approximated by the span of low rank matrices. The proposed framework is further extended to a noise-tolerant version by adopting a hinge-loss alternatively. To facilitate efficient computation on large scale data, a parallel extension is developed. Experiments are conducted on the DBLP and CoRA datasets. The results show that FSL is robust, efficient, and outperforms the state-of-the-art.
Keywords :
data mining; information retrieval; learning (artificial intelligence); matrix decomposition; pattern classification; recommender systems; CoRA dataset; DBLP dataset; FSL; data mining application; factorized similarity learning; holistic similarity function; low rank matrices; matrix factorization; parallel extension; sim rank; similarity learning method; Equations; Linear programming; Noise measurement; Optimization; Silicon; Sparse matrices; Content; Link; Network similarity; Supervised matrix factorization; Supervision;
Conference_Titel :
Data Mining (ICDM), 2014 IEEE International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4799-4303-6
DOI :
10.1109/ICDM.2014.115