Title :
A new digital audio system design to cope with High Audio Scene (HAS) encoding technology for all round applications
Author :
Ralph, W.L. ; Percy, W.H.
Author_Institution :
Dept. of Mech. Eng., Univ. of Hong Kong, Hong Kong, China
Abstract :
A brand new audio signal processing technology namely “High Audio Scene (HAS)” has been developed to compensate the inadequacies of Dolby Digital formats that widely used in daily life audio processing systems. The challenging of using Dolby systems is the expected acoustic conditions including building environment and audio configuration facilities should be satisfied. The coded multiple channels signal from HAS encoders are from ordinary stereo sources without the expensive set up in source recording. The quality of the regenerated sound is compatible to Dolby Surround EX and less acoustically controlled environment is needed. The audio systems configured either in 2.1-, 3.2- or 5.2-channel HAS format can generate a VAST and STRONG VOCAL audio effect similar to the hearing in a natural environment. However, less preserved power is need because of using interference characteristics can intensify the sound sources to many times. The technology is expected to be widely applied for different environment including classrooms, dwells, corridors, auditoriums, cinemas, and concert halls without much building re-revolution work.
Keywords :
audio coding; Dolby Digital formats; Dolby Surround EX; HAS encoders; HAS encoding technology; HAS format; acoustic conditions; audio configuration facilities; audio signal processing technology; auditoriums; building environment; cinemas; classrooms; coded multiple-channel signal; concert halls; corridors; digital audio system design; dwells; high-audio scene encoding; interference characteristics; regenerated sound quality; sound sources; source recording; stereo sources; vocal audio effect; Acoustics; Buildings; Encoding; Interference; Loudspeakers; Vibrations;
Conference_Titel :
Audio, Language and Image Processing (ICALIP), 2012 International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4673-0173-2
DOI :
10.1109/ICALIP.2012.6376607