Title :
Dynamic Time Warping Averaging of Time Series Allows Faster and More Accurate Classification
Author :
Petitjean, Francois ; Forestier, Germain ; Webb, Geoffrey I. ; Nicholson, Ann E. ; Yanping Chen ; Keogh, Eamonn
Author_Institution :
Fac. of IT, Monash Univ., Melbourne, VIC, Australia
Abstract :
Recent years have seen significant progress in improving both the efficiency and effectiveness of time series classification. However, because the best solution is typically the Nearest Neighbor algorithm with the relatively expensive Dynamic Time Warping as the distance measure, successful deployments on resource constrained devices remain elusive. Moreover, the recent explosion of interest in wearable devices, which typically have limited computational resources, has created a growing need for very efficient classification algorithms. A commonly used technique to glean the benefits of the Nearest Neighbor algorithm, without inheriting its undesirable time complexity, is to use the Nearest Centroid algorithm. However, because of the unique properties of (most) time series data, the centroid typically does not resemble any of the instances, an unintuitive and underappreciated fact. In this work we show that we can exploit a recent result to allow meaningful averaging of ´warped´ times series, and that this result allows us to create ultra-efficient Nearest ´Centroid´ classifiers that are at least as accurate as their more lethargic Nearest Neighbor cousins.
Keywords :
computational complexity; pattern classification; time series; dynamic time warping averaging; nearest centroid classifiers; nearest neighbor algorithm; resource constrained devices; time complexity; time series classification; warped time series averaging; wearable devices; Accuracy; Artificial neural networks; Classification algorithms; Heuristic algorithms; Prototypes; Time series analysis; Training; Dynamic Time Warping; Nearest Neighbor; Nearest centroid; Time series averaging; Time series classification;
Conference_Titel :
Data Mining (ICDM), 2014 IEEE International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4799-4303-6
DOI :
10.1109/ICDM.2014.27