DocumentCode :
2449850
Title :
Transient thermal model of a medium frequency power transformer
Author :
Villar, Irma ; Viscarret, Unai ; Etxeberria-Otadui, Ion ; Rufer, Alfred
Author_Institution :
Control Eng. & Power Electron. Area, IKERLAN-IK4 Technol. Res. Centre, Arrasate-Mondragon
fYear :
2008
fDate :
10-13 Nov. 2008
Firstpage :
1033
Lastpage :
1038
Abstract :
Nowadays medium voltage conversion systems, like traction and energy distribution systems, aim to increase power density. Volume, weight and material reduction are gaining the market today. Due to the development of new high power semi-conductor devices a new working frequency range is conceived, where magnetic component reduction is feasible. However, along with the reduction of magnetic component size, the cooling surface is reduced, increasing the equilibrium temperature of the magnetic components. The core element of these new conversion systems is the medium frequency power transformer. In this paper a dynamic thermal model is introduced, with equivalent non-linear temperature dependent thermal resistances. Besides, heat sources are determined taking into account non-sinusoidal excitations, and frequency dependent effects. For our case study, the model shows natural heat dissipation limits, pointing out the cooling requirements throughout the design process.
Keywords :
cooling; power semiconductor devices; power transformers; cooling surface reduction; equivalent nonlinear temperature dependent thermal resistances; heat dissipation; high power semiconductor device; magnetic component reduction; medium frequency power transformer; transient thermal model; Cooling; Frequency; Magnetic devices; Magnetic materials; Medium voltage; Power system modeling; Power transformers; Temperature; Thermal resistance; Transformer cores;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Electronics, 2008. IECON 2008. 34th Annual Conference of IEEE
Conference_Location :
Orlando, FL
ISSN :
1553-572X
Print_ISBN :
978-1-4244-1767-4
Electronic_ISBN :
1553-572X
Type :
conf
DOI :
10.1109/IECON.2008.4758096
Filename :
4758096
Link To Document :
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