• DocumentCode
    2449850
  • Title

    Transient thermal model of a medium frequency power transformer

  • Author

    Villar, Irma ; Viscarret, Unai ; Etxeberria-Otadui, Ion ; Rufer, Alfred

  • Author_Institution
    Control Eng. & Power Electron. Area, IKERLAN-IK4 Technol. Res. Centre, Arrasate-Mondragon
  • fYear
    2008
  • fDate
    10-13 Nov. 2008
  • Firstpage
    1033
  • Lastpage
    1038
  • Abstract
    Nowadays medium voltage conversion systems, like traction and energy distribution systems, aim to increase power density. Volume, weight and material reduction are gaining the market today. Due to the development of new high power semi-conductor devices a new working frequency range is conceived, where magnetic component reduction is feasible. However, along with the reduction of magnetic component size, the cooling surface is reduced, increasing the equilibrium temperature of the magnetic components. The core element of these new conversion systems is the medium frequency power transformer. In this paper a dynamic thermal model is introduced, with equivalent non-linear temperature dependent thermal resistances. Besides, heat sources are determined taking into account non-sinusoidal excitations, and frequency dependent effects. For our case study, the model shows natural heat dissipation limits, pointing out the cooling requirements throughout the design process.
  • Keywords
    cooling; power semiconductor devices; power transformers; cooling surface reduction; equivalent nonlinear temperature dependent thermal resistances; heat dissipation; high power semiconductor device; magnetic component reduction; medium frequency power transformer; transient thermal model; Cooling; Frequency; Magnetic devices; Magnetic materials; Medium voltage; Power system modeling; Power transformers; Temperature; Thermal resistance; Transformer cores;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 2008. IECON 2008. 34th Annual Conference of IEEE
  • Conference_Location
    Orlando, FL
  • ISSN
    1553-572X
  • Print_ISBN
    978-1-4244-1767-4
  • Electronic_ISBN
    1553-572X
  • Type

    conf

  • DOI
    10.1109/IECON.2008.4758096
  • Filename
    4758096