DocumentCode :
2450666
Title :
Predictive technology characterization, missing links between TCAD and compact modeling
Author :
McAndrew, Colin C.
Author_Institution :
Motorola Inc., Tempe, AZ, USA
fYear :
2000
fDate :
2000
Firstpage :
12
Lastpage :
17
Abstract :
Predictive modeling of components in IC manufacturing technologies is an essential part of coupled technology and circuit development. TCAD simulation is often viewed as the best method to generate predictive simulations; however, it has some limitations. Engineering experience, extrapolated technology requirements, and compact models all must be invoked in the provision of predictive circuit level technology data. This paper describes the techniques and information required for effective and efficient engineering predictions of technology capability, including statistical variations, and notes deficiencies (and therefore opportunities) in the TCAD simulations that underlie compact modeling for predictive technology characterization
Keywords :
circuit CAD; integrated circuit design; semiconductor process modelling; statistical analysis; technology CAD (electronics); IC manufacturing technologies; TCAD; TCAD deficiencies; TCAD simulation; compact modeling; compact models; coupled technology/circuit development; engineering predictions; extrapolated technology requirements; predictive circuit level technology data; predictive component modeling; predictive simulations; predictive technology characterization; statistical variations; technology capability; Analog integrated circuits; Circuit simulation; Circuit synthesis; Design engineering; Integrated circuit modeling; Integrated circuit synthesis; Manufacturing processes; Predictive models; Signal design; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2000. SISPAD 2000. 2000 International Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-6279-9
Type :
conf
DOI :
10.1109/SISPAD.2000.871195
Filename :
871195
Link To Document :
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