DocumentCode
2450666
Title
Predictive technology characterization, missing links between TCAD and compact modeling
Author
McAndrew, Colin C.
Author_Institution
Motorola Inc., Tempe, AZ, USA
fYear
2000
fDate
2000
Firstpage
12
Lastpage
17
Abstract
Predictive modeling of components in IC manufacturing technologies is an essential part of coupled technology and circuit development. TCAD simulation is often viewed as the best method to generate predictive simulations; however, it has some limitations. Engineering experience, extrapolated technology requirements, and compact models all must be invoked in the provision of predictive circuit level technology data. This paper describes the techniques and information required for effective and efficient engineering predictions of technology capability, including statistical variations, and notes deficiencies (and therefore opportunities) in the TCAD simulations that underlie compact modeling for predictive technology characterization
Keywords
circuit CAD; integrated circuit design; semiconductor process modelling; statistical analysis; technology CAD (electronics); IC manufacturing technologies; TCAD; TCAD deficiencies; TCAD simulation; compact modeling; compact models; coupled technology/circuit development; engineering predictions; extrapolated technology requirements; predictive circuit level technology data; predictive component modeling; predictive simulations; predictive technology characterization; statistical variations; technology capability; Analog integrated circuits; Circuit simulation; Circuit synthesis; Design engineering; Integrated circuit modeling; Integrated circuit synthesis; Manufacturing processes; Predictive models; Signal design; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2000. SISPAD 2000. 2000 International Conference on
Conference_Location
Seattle, WA
Print_ISBN
0-7803-6279-9
Type
conf
DOI
10.1109/SISPAD.2000.871195
Filename
871195
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