• DocumentCode
    2450666
  • Title

    Predictive technology characterization, missing links between TCAD and compact modeling

  • Author

    McAndrew, Colin C.

  • Author_Institution
    Motorola Inc., Tempe, AZ, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    12
  • Lastpage
    17
  • Abstract
    Predictive modeling of components in IC manufacturing technologies is an essential part of coupled technology and circuit development. TCAD simulation is often viewed as the best method to generate predictive simulations; however, it has some limitations. Engineering experience, extrapolated technology requirements, and compact models all must be invoked in the provision of predictive circuit level technology data. This paper describes the techniques and information required for effective and efficient engineering predictions of technology capability, including statistical variations, and notes deficiencies (and therefore opportunities) in the TCAD simulations that underlie compact modeling for predictive technology characterization
  • Keywords
    circuit CAD; integrated circuit design; semiconductor process modelling; statistical analysis; technology CAD (electronics); IC manufacturing technologies; TCAD; TCAD deficiencies; TCAD simulation; compact modeling; compact models; coupled technology/circuit development; engineering predictions; extrapolated technology requirements; predictive circuit level technology data; predictive component modeling; predictive simulations; predictive technology characterization; statistical variations; technology capability; Analog integrated circuits; Circuit simulation; Circuit synthesis; Design engineering; Integrated circuit modeling; Integrated circuit synthesis; Manufacturing processes; Predictive models; Signal design; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2000. SISPAD 2000. 2000 International Conference on
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    0-7803-6279-9
  • Type

    conf

  • DOI
    10.1109/SISPAD.2000.871195
  • Filename
    871195