Title :
Time domain simulation of uniform and nonuniform multiconductor lossy lines by the method of characteristics
Author :
Orhanovic, N. ; Tripathi, V.K. ; Wang, P.
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
A numerical technique for computing the time-domain response of multiconductor lossy uniform and nonuniform lines terminated in general nonlinear elements is presented. The technique is based on the generalized method of characteristics and is used to study signal delay, distortions, and crosstalk in interconnection in integrated circuits and chip carriers. The step response of typical uniform and nonuniform structures is computed utilizing the technique. For lossless uniformly coupled lines the step response is found to be in agreement with those reported in the literature. All the calculations were performed on a desktop computer. The capacitance, inductance, resistance, and conductance matrices can be computed by utilizing various available numerical techniques such as those based on finite difference, boundary element, and spectral domain methods. The diagonal resistance matrix elements in these examples are taken as constant corresponding to the low frequency quasi-static solution.<>
Keywords :
circuit analysis computing; crosstalk; numerical methods; time-domain analysis; transmission line theory; boundary element; capacitance; chip carriers; conductance matrices; crosstalk; diagonal resistance matrix elements; distortions; finite difference; inductance; lossless uniformly coupled lines; method of characteristics; nonlinear elements; nonuniform multiconductor lossy lines; numerical technique; quasi-static solution; resistance; signal delay; spectral domain methods; step response; time-domain response; Capacitance; Computational modeling; Coupling circuits; Crosstalk; Delay; Finite difference methods; Inductance; Integrated circuit interconnections; Nonlinear distortion; Time domain analysis;
Conference_Titel :
Microwave Symposium Digest, 1990., IEEE MTT-S International
Conference_Location :
Dallas, TX
DOI :
10.1109/MWSYM.1990.99792