Title :
Testing in a high volume DSM environment
Author_Institution :
BAE Syst., Manassas, VA, USA
Abstract :
DSM manufacturing is expensive. It has been estimated that it costs in excess of &rlarr2; to build a 90nm line. DSM designs are much more susceptible to topological based deformations. Finally, in the DSM environment, it becomes increasingly difficult to separate design vs. process marginalities. Clearly one goal of design for manufacturability is to avoid such sensitivities where identified. This requires an in depth knowledge of the process "sweet spots," acquired initially via test sites especially developed with this objective, followed by focussed diagnosis of the product itself. Since it is unrealistic to assume that ATE is an economically viable solution for the speed requirements, at-speed BIST techniques prevails.
Keywords :
automatic test equipment; built-in self test; design for manufacture; integrated circuit testing; ATE; at-speed BIST techniques; deep sub micron design; deep sub micron environment; design for manufacturability; testing; Circuit testing; Costs; Environmental economics; Graphics; Inspection; Manufacturing; Microprocessors; Semiconductor device manufacture; System testing; Vehicles;
Conference_Titel :
Test Conference, 2004. Proceedings. ITC 2004. International
Print_ISBN :
0-7803-8580-2
DOI :
10.1109/TEST.2004.1387430