Title :
Electron transport properties in novel orthorhombically-strained silicon material explored by the Monte Carlo method
Author :
Wang, Xin ; Kencke, D.L. ; Liu, K.C. ; Tasch, A.F., Jr. ; Register, L.F. ; Banerjee, S.K.
Author_Institution :
Microelectron. Res. Center, Texas Univ., Austin, TX, USA
Abstract :
We report for the first time on the electron transport properties of simple orthorhombically-strained silicon studied by density-functional theory and Monte Carlo simulation. The six degenerate valleys near X points in bulk silicon break into three pairs with different energy minima due to the orthorhombic strain. The degeneracy lifting causes electron redistribution among these valleys at low and intermediate electric fields. Thus the drift velocity is enhanced under an electric field transverse to the long-axis of the lowest valleys. The simple orthorhombically-strained Si grown on a Si-Si0.6Ge0.4 sidewall has a low-field mobility almost twice that of bulk Si and an electron saturation velocity approximately 20% higher
Keywords :
Monte Carlo methods; band structure; carrier lifetime; degenerate semiconductors; density functional theory; electric fields; electron mobility; elemental semiconductors; internal stresses; silicon; Monte Carlo method; Monte Carlo simulation; Si-Si0.6Ge0.4; Si0.6Ge0.4; Si0.6Ge0.4 sidewall; bulk silicon; degeneracy lifting; degenerate valleys; density-functional theory; drift velocity; electron redistribution; electron saturation velocity; electron transport properties; energy minima; intermediate electric fields; low electric fields; low-field mobility; orthorhombic strain; orthorhombically-strained Si growth; orthorhombically-strained silicon; transverse electric field; valley long-axis; Brillouin scattering; Capacitive sensors; Effective mass; Electron mobility; Germanium silicon alloys; Lattices; Microelectronics; Shape; Silicon alloys; Silicon germanium;
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2000. SISPAD 2000. 2000 International Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-6279-9
DOI :
10.1109/SISPAD.2000.871209