DocumentCode
2451100
Title
An extracting capacitance in a stacked DRAM cell by numerical method
Author
Yoon, Skin ; Kwon, Ohseb ; Yoon, Sangho ; Won, Taeyoung
Author_Institution
Div. of Electr. & Comput. Eng., Inha Univ., Inchon, South Korea
fYear
2000
fDate
2000
Firstpage
94
Lastpage
97
Abstract
This paper reports a methodology and its application for extracting the capacitance of a stacked DRAM cell structure by a numerical technique. To calculate the cell and parasitic capacitance in a stacked DRAM cell, we employed the finite element method (FEM), and to generate a complicated three-dimensional mesh structure, we used a graphic user interface, a topography simulator and three dimensional grid generator. A concave cylindrical DRAM cell capacitor with a minimum feature size of 0.25 μm was chosen as a test vehicle to check the validity of the simulation. In this work, 62 parasitic capacitance values with 4 cell capacitance values were extracted from a stacked DRAM cell structure
Keywords
DRAM chips; capacitance; capacitors; circuit simulation; graphical user interfaces; integrated circuit measurement; integrated circuit modelling; mesh generation; surface topography; 0.25 micron; 3D grid generator; 3D mesh structure generation; FEM; capacitance; capacitance extraction; cell capacitance; concave cylindrical DRAM cell capacitor; finite element method; graphic user interface; minimum feature size; numerical method; numerical technique; parasitic capacitance; simulation validity; stacked DRAM cell; stacked DRAM cell structure; test vehicle; topography simulator; Capacitors; Finite element methods; Graphics; Mesh generation; Parasitic capacitance; Random access memory; Surfaces; Testing; User interfaces; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 2000. SISPAD 2000. 2000 International Conference on
Conference_Location
Seattle, WA
Print_ISBN
0-7803-6279-9
Type
conf
DOI
10.1109/SISPAD.2000.871216
Filename
871216
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