• DocumentCode
    2451100
  • Title

    An extracting capacitance in a stacked DRAM cell by numerical method

  • Author

    Yoon, Skin ; Kwon, Ohseb ; Yoon, Sangho ; Won, Taeyoung

  • Author_Institution
    Div. of Electr. & Comput. Eng., Inha Univ., Inchon, South Korea
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    94
  • Lastpage
    97
  • Abstract
    This paper reports a methodology and its application for extracting the capacitance of a stacked DRAM cell structure by a numerical technique. To calculate the cell and parasitic capacitance in a stacked DRAM cell, we employed the finite element method (FEM), and to generate a complicated three-dimensional mesh structure, we used a graphic user interface, a topography simulator and three dimensional grid generator. A concave cylindrical DRAM cell capacitor with a minimum feature size of 0.25 μm was chosen as a test vehicle to check the validity of the simulation. In this work, 62 parasitic capacitance values with 4 cell capacitance values were extracted from a stacked DRAM cell structure
  • Keywords
    DRAM chips; capacitance; capacitors; circuit simulation; graphical user interfaces; integrated circuit measurement; integrated circuit modelling; mesh generation; surface topography; 0.25 micron; 3D grid generator; 3D mesh structure generation; FEM; capacitance; capacitance extraction; cell capacitance; concave cylindrical DRAM cell capacitor; finite element method; graphic user interface; minimum feature size; numerical method; numerical technique; parasitic capacitance; simulation validity; stacked DRAM cell; stacked DRAM cell structure; test vehicle; topography simulator; Capacitors; Finite element methods; Graphics; Mesh generation; Parasitic capacitance; Random access memory; Surfaces; Testing; User interfaces; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2000. SISPAD 2000. 2000 International Conference on
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    0-7803-6279-9
  • Type

    conf

  • DOI
    10.1109/SISPAD.2000.871216
  • Filename
    871216