• DocumentCode
    2451328
  • Title

    In-situ observation of electrode melting in multilayer-ceramic capacitors

  • Author

    Ling, H.C. ; Chang, D.D.

  • Author_Institution
    AT&T Eng. Res. Center, Princeton, NJ, USA
  • fYear
    1988
  • fDate
    9-11 May 1988
  • Firstpage
    87
  • Lastpage
    94
  • Abstract
    Observations on sectioned and polished multilayer ceramic capacitors, which were subjected to controlled current-surge test conditions, are presented. Capacitors from several vendors were examined in situ under an optical microscope while current pulses of varying magnitude were applied at a constant voltage. Subsequently, some samples were further examined by scanning electron microscopy (SEM). The failure mechanism appeared to be the heat-induced local melting of internal electrodes, leading to blow-out or charring of the capacitor. In less severe cases, local melting and crack formation in the surrounding ceramic was observed. The primary change in capacitor properties was in the degradation of the insulation resistance (IR). In severe cases, this also led to an increase in the dissipation factor (DF).<>
  • Keywords
    capacitors; electron device testing; failure analysis; reliability; scanning electron microscopy; MLC capacitors; SEM; blow-out; charring; constant voltage; controlled current-surge test conditions; crack formation; current pulses; dissipation factor; electrode melting; failure mechanism; heat-induced local melting; in situ observations; insulation resistance; internal electrodes; multilayer-ceramic capacitors; optical microscope; polished multilayer ceramic; scanning electron microscopy; sectioned capacitors; several vendors; Capacitors; Ceramics; Electrodes; Electron optics; Nonhomogeneous media; Optical microscopy; Optical pulses; Scanning electron microscopy; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Components Conference, 1988., Proceedings of the 38th
  • Conference_Location
    Los Angeles, CA, USA
  • Type

    conf

  • DOI
    10.1109/ECC.1988.12574
  • Filename
    12574