DocumentCode :
2451451
Title :
Modeling of initial stages of annealing for amorphizing arsenic implants
Author :
Fastenko, Pavel ; Dunham, Scott T. ; Murphy, Brendon
Author_Institution :
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
fYear :
2000
fDate :
2000
Firstpage :
171
Lastpage :
174
Abstract :
We have analyzed the initial stages of annealing for amorphizing arsenic implants. The comparison of transient enhanced diffusion (TED) simulations to experimental data shows results that appear inconsistent with the standard assumption of complete removal of point defects from the regrown amorphized layer. Our analysis suggests that high arsenic concentrations may stabilize retention of vacancies during solid phase epitaxial regrowth and thereby lead to the formation of a vacancy-rich layer near the surface within the regrown region. The presence of this vacancy rich layer helps to account for both increased initial diffusion within the peak region for high temperature annealing and increased clustering in the peak region for lower temperatures
Keywords :
amorphisation; amorphous semiconductors; annealing; arsenic; diffusion; elemental semiconductors; ion implantation; segregation; semiconductor process modelling; silicon; solid phase epitaxial growth; vacancies (crystal); Si:As; TED simulations; amorphizing arsenic implants; annealing; arsenic concentration; clustering; high temperature annealing; initial diffusion; lower temperature annealing; modeling; point defects; regrown amorphized layer; regrown region; solid phase epitaxial regrowth; transient enhanced diffusion; vacancy retention stabilization; vacancy-rich layer; Amorphous materials; Analytical models; Annealing; Computational modeling; Crystallization; Implants; Semiconductor process modeling; Shape; Solids; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2000. SISPAD 2000. 2000 International Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-6279-9
Type :
conf
DOI :
10.1109/SISPAD.2000.871235
Filename :
871235
Link To Document :
بازگشت