• DocumentCode
    2451875
  • Title

    Extraction of the physical oxide thickness using the electrical characteristics of MOS capacitors

  • Author

    Eikyu, K. ; Takashino, H. ; Kidera, M. ; Teramoto, A. ; Umeda, H. ; Ishikawa, K. ; Kotani, N. ; Inuishi, M.

  • Author_Institution
    ULSI Dev. Center, Mitsubishi Electr. Corp., Itami, Japan
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    257
  • Lastpage
    260
  • Abstract
    The physical oxide thickness of ultrathin oxides is extracted using the tunneling current characteristics of MOS capacitors. An extraction tool has been developed for the semiautomatic extraction. The tool implements a nonlinear least square solver and GUIs. A tunneling current model is incorporated into the MIDSIP-T device simulator and it is used as a core simulator of the extraction system. It is found that the transition layer should be considered in the extraction of very thin oxide thickness below 4 nm. A unified parameter set, φb=3.3 eV and mc*/m0=0.41, is obtained after the extraction of various samples
  • Keywords
    MOS capacitors; MOS integrated circuits; dielectric thin films; graphical user interfaces; least squares approximations; semiconductor device measurement; semiconductor device models; tunnelling; 3.3 eV; GUIs; MIDSIP-T device simulator; MOS capacitors; SiO2-Si; core simulator; electrical characteristics; extraction system; extraction tool; nonlinear least square solver; physical oxide thickness; physical oxide thickness extraction; sample extraction; semiautomatic extraction; transition layer; tunneling current characteristics; tunneling current model; ultrathin oxides; unified parameter set; very thin oxide thickness; Capacitance-voltage characteristics; Electric variables; Least squares methods; MOS capacitors; MOSFETs; Oxidation; Semiconductor devices; Thickness measurement; Tunneling; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2000. SISPAD 2000. 2000 International Conference on
  • Conference_Location
    Seattle, WA
  • Print_ISBN
    0-7803-6279-9
  • Type

    conf

  • DOI
    10.1109/SISPAD.2000.871257
  • Filename
    871257