The effect of impedance matching to high-speed connector´s signal integrity

The high-speed interconnection solutions have been used in almost all electronic products, so connector´s signal transmission quality has also become a critical factor in the design of high-speed applications. Thus, in the design of high-speed connector applications, the impedance matching, cross talk, propagating delay and alignment shape of connector are important factors to be considered. The impedance matching is the prerequisite for solving the signal integrity, this paper proposes the impedance matching rule of high-speed connector through theoretical calculation and software simulation, thereby effectively resolving the problem of signal integrity which impedance mismatching leads to.