Title :
Vertical Inline SAW Package (VISP)
Author :
Erikson, C.A., Jr. ; LeSiege, D.R.
fDate :
Oct. 31 1983-Nov. 2 1983
Keywords :
Bonding; Ceramics; Circuit optimization; Costs; Dielectric substrates; Fabrication; Packaging; Printed circuits; Surface acoustic wave devices; Surface acoustic waves;
Conference_Titel :
1983 Ultrasonics Symposium
Conference_Location :
Atlanta, GA, USA
DOI :
10.1109/ULTSYM.1983.198028
