• DocumentCode
    2454046
  • Title

    GaInP/GaAs HBTs: state of the art and future trends

  • Author

    Wadsworth, S.D. ; Davies, R.A. ; Davies, I. ; Marsh, S.P. ; Peniket, N.A. ; Phillips, W.A. ; Wallis, R.H.

  • Author_Institution
    GEC-Marconi Mater. Technol. Ltd., Towcester, UK
  • fYear
    1998
  • fDate
    29 Sep-2 Oct 1998
  • Firstpage
    40
  • Lastpage
    44
  • Abstract
    The features of GaInP/GaAs HBT technology are illustrated by a description of the advanced general purpose GMMT B20 process, which has fT and fmax typically 50 GHz and a breakdown voltage BVCEO in excess of 10 volts. This process has been used for the design of analogue and digital circuits in order to demonstrate a capability for the fabrication of a range of high linearity and broadband circuits for communication systems. A survey of the current state of the art of HBTs is presented, focusing on the process variations needed to address specific applications, and including a comparison with HBT technologies developed on other material combinations. The key parameters determining high-frequency performance are identified in order to assess future trends and performance limitations, including reliability and thermal issues
  • Keywords
    III-V semiconductors; gallium arsenide; gallium compounds; heterojunction bipolar transistors; indium compounds; microwave bipolar transistors; semiconductor device breakdown; semiconductor device reliability; 50 GHz; GMMT B20 process; HBTs; III-V semiconductors; breakdown voltage; high-frequency performance; linearity; microwave bipolar transistors; process variations; reliability; thermal issues; Bipolar transistors; Digital circuits; Frequency; Gallium arsenide; Heterojunction bipolar transistors; Isolation technology; Manufacturing processes; Microwave devices; Power amplifiers; Semiconductor materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signals, Systems, and Electronics, 1998. ISSSE 98. 1998 URSI International Symposium on
  • Conference_Location
    Pisa
  • Print_ISBN
    0-7803-4900-8
  • Type

    conf

  • DOI
    10.1109/ISSSE.1998.738033
  • Filename
    738033