Title :
Temperature control of wafer in semiconductor manufacturing systems by MR-ILQ design method
Author :
Matsumoto, Kaname ; Suzuki, Keita ; Kunimatsu, Sadaaki ; Fujii, Takao
Author_Institution :
Dept. of Syst. Innovation, Graduate Sch. of Eng. Sci., Osaka, Japan
Abstract :
We consider control system synthesis for temperature control of a wafer in the semiconductor manufacturing system by using model reference inverse linear quadratic (abbreviated as MR-ILQ) control, which was proposed by the third and fourth authors [S. Kunimatsu and T. Fujii, 2003], as one of its significant applications in the industry process. First, we apply the subspace method [P.V. Overschee and B.D. Moor, 1994], [M. Verhaegen, 1994] to obtain a mathematical model described by multi-input multi-output state space representations for temperature dynamics of the wafer. Second, we design a robust servo system for tracking a step reference input without steady state error based on the MR-ILQ design method. Since this method yields not only robust steady state tracking but also robust transient tracking, it is possible to design a temperature control system with higher robust performance. Third, we show the efficiency of the above control system synthesis by experiment.
Keywords :
control system synthesis; linear quadratic control; mathematical analysis; process control; semiconductor device manufacture; servomechanisms; temperature control; MR-ILQ design method; control system synthesis; industry process; mathematical model; model reference inverse linear quadratic control; multiinput multioutput state space representations; robust servo system; semiconductor manufacturing systems; subspace method; temperature control; Control system synthesis; Design methodology; Electrical equipment industry; Inverse problems; Manufacturing industries; Manufacturing systems; Robust control; Semiconductor device modeling; Steady-state; Temperature control;
Conference_Titel :
Control Applications, 2004. Proceedings of the 2004 IEEE International Conference on
Print_ISBN :
0-7803-8633-7
DOI :
10.1109/CCA.2004.1387572