Title :
A multichip module integration technology for high-speed analog and digital applications
Author :
Mangold, T. ; Wolf, J. ; Topper, M. ; Reich, H. ; Russer, P.
Author_Institution :
Lehrstuhl fur Hochfrequenztech., Tech. Univ. Munchen, Germany
fDate :
29 Sep-2 Oct 1998
Abstract :
We present a planar multichip module integration technology intended for high frequency applications. Bare dice are placed in substrate openings and connected thru a thin film multilayer realized in a planar fashion on top of the embedded system. It is built of dielectric polymer layers and a sputtered/electroplated copper wiring on ceramic or silicon substrate. Polyimid PyralinTM (2722 (Du Pont) and CycloteneTM (4026-46 (Dow Chemical) are used as interlevel dielectric. Metalization is based on a Ti:W/Cu tie layer, which is subsequently electroplated with Cu. The paper also addresses high frequency performance of the described technology, electromagnetic full-wave modeling and equivalent circuit model extraction
Keywords :
equivalent circuits; high-speed integrated circuits; integrated circuit technology; multichip modules; Cu; Cyclotene; MCM-D; Polyimid Pyralin; Ti:W/Cu tie layer; analog circuit; ceramic substrate; digital circuit; electromagnetic full-wave model; electroplated copper wiring; embedded system; equivalent circuit; high-speed circuit; interlevel dielectric; metallization; parameter extraction; planar multichip module integration technology; polymer film; silicon substrate; sputtered copper wiring; thin film multilayer; Copper; Dielectric substrates; Dielectric thin films; Electromagnetic modeling; Embedded system; Frequency; Multichip modules; Nonhomogeneous media; Polymer films; Sputtering;
Conference_Titel :
Signals, Systems, and Electronics, 1998. ISSSE 98. 1998 URSI International Symposium on
Conference_Location :
Pisa
Print_ISBN :
0-7803-4900-8
DOI :
10.1109/ISSSE.1998.738045
