DocumentCode
2454385
Title
CMOS VLSI technologies and RF application challenges
Author
Fazan, P.C. ; Declercq, M.
Author_Institution
Dept. of Electr. Eng., Fed. Inst. of Technol., Lausanne, Switzerland
fYear
1998
fDate
29 Sep-2 Oct 1998
Firstpage
128
Lastpage
133
Abstract
This paper reviews the key steps that have led to today´s CMOS VLSI technologies. The discussion covers process technology, process integration, manufacturing topics, as well as implications for RF device design
Keywords
CMOS integrated circuits; VLSI; integrated circuit manufacture; integrated circuit technology; radio equipment; CMOS VLSI technologies; CMOS device scaling; IC manufacture; RF application; RF chips; RF device design; devices interconnection; dry etching; lithography; process integration; process technology; CMOS technology; Costs; Electronics industry; Integrated circuit technology; Laboratories; Leg; MOS devices; Moore´s Law; Radio frequency; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Signals, Systems, and Electronics, 1998. ISSSE 98. 1998 URSI International Symposium on
Conference_Location
Pisa
Print_ISBN
0-7803-4900-8
Type
conf
DOI
10.1109/ISSSE.1998.738052
Filename
738052
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