DocumentCode
245451
Title
Quantifying workload dependent reliability in embedded processors
Author
Chandra, Vishal
Author_Institution
ARM R&D, San Jose, CA, USA
fYear
2014
fDate
20-23 Jan. 2014
Firstpage
474
Lastpage
477
Abstract
With nearly three decades of continued CMOS scaling, the devices have now been pushed to their physical and reliability limits. Scaling to sub-20nm technology nodes changes the nature of reliability effects from abrupt functional problems to progressive degradation of the performance characteristics of devices and system components. The impact of unreliability results in time-dependent variability, directly translating into design uncertainty in manufactured chips. Further, application workloads can significantly affect the overall system reliability. In this work, we have analyzed aging effects on various design hierarchies of an embedded processor in 28nm running real-world applications. We have also quantified the dependencies of aging effects on switching-activity and power-state of workloads. Implementation results show that the processor timing degradation can vary from 2% to 11%, depending on the workload.
Keywords
CMOS digital integrated circuits; ageing; embedded systems; integrated circuit reliability; aging effects; continued CMOS scaling; device performance characteristics; embedded processors; manufactured chips; overall system reliability; physical limit; processor timing degradation; reliability effects; reliability limit; running real-world application; size 20 nm; switching-activity; system component performance characteristics; technology nodes; time-dependent variability; workload dependent reliability quantification; Aging; Degradation; Integrated circuit reliability; Libraries; Program processors; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference (ASP-DAC), 2014 19th Asia and South Pacific
Conference_Location
Singapore
Type
conf
DOI
10.1109/ASPDAC.2014.6742936
Filename
6742936
Link To Document