• DocumentCode
    245451
  • Title

    Quantifying workload dependent reliability in embedded processors

  • Author

    Chandra, Vishal

  • Author_Institution
    ARM R&D, San Jose, CA, USA
  • fYear
    2014
  • fDate
    20-23 Jan. 2014
  • Firstpage
    474
  • Lastpage
    477
  • Abstract
    With nearly three decades of continued CMOS scaling, the devices have now been pushed to their physical and reliability limits. Scaling to sub-20nm technology nodes changes the nature of reliability effects from abrupt functional problems to progressive degradation of the performance characteristics of devices and system components. The impact of unreliability results in time-dependent variability, directly translating into design uncertainty in manufactured chips. Further, application workloads can significantly affect the overall system reliability. In this work, we have analyzed aging effects on various design hierarchies of an embedded processor in 28nm running real-world applications. We have also quantified the dependencies of aging effects on switching-activity and power-state of workloads. Implementation results show that the processor timing degradation can vary from 2% to 11%, depending on the workload.
  • Keywords
    CMOS digital integrated circuits; ageing; embedded systems; integrated circuit reliability; aging effects; continued CMOS scaling; device performance characteristics; embedded processors; manufactured chips; overall system reliability; physical limit; processor timing degradation; reliability effects; reliability limit; running real-world application; size 20 nm; switching-activity; system component performance characteristics; technology nodes; time-dependent variability; workload dependent reliability quantification; Aging; Degradation; Integrated circuit reliability; Libraries; Program processors; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2014 19th Asia and South Pacific
  • Conference_Location
    Singapore
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2014.6742936
  • Filename
    6742936