• DocumentCode
    2454630
  • Title

    Toward integrated design tools: analysis of wave-semiconductor device interactions

  • Author

    Hammadi, S. ; Remley, K. ; El-Ghazaly, S. ; Goodnick, S. ; Grondin, R.

  • Author_Institution
    Dept. of Electr. Eng., Arizona State Univ., Tempe, AZ, USA
  • fYear
    1998
  • fDate
    29 Sep-2 Oct 1998
  • Firstpage
    209
  • Abstract
    Discusses the interactions between semiconductor devices and electromagnetic waves and the possible ways to interface modern devices and circuits in the mm-wave range. The electromagnetic wave propagation through semiconductor devices is modeled by coupling a physical electron-transport model with Maxwell´s equations. The solution is developed in the time-domain using the finite-difference time-domain (FDTD) technique. The signal propagation through the passive part of the circuit is analyzed by solving Maxwell´s equations using the FDTD technique. The models are implemented and used for studying circuits with operating frequencies from the microwaves up to the optical range. Several examples of device and circuit simulations will be presented
  • Keywords
    Maxwell equations; circuit simulation; finite difference time-domain analysis; millimetre wave circuits; millimetre wave transistors; semiconductor device models; Maxwell´s equations; circuit simulations; device simulations; electromagnetic wave interaction; electromagnetic wave propagation; finite-difference time-domain technique; integrated design tools; mm-wave range devices; physical electron-transport model; signal propagation; wave-semiconductor device interactions; Coupling circuits; Electromagnetic coupling; Electromagnetic modeling; Electromagnetic propagation; Electromagnetic scattering; Finite difference methods; Maxwell equations; Microwave propagation; Semiconductor devices; Time domain analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signals, Systems, and Electronics, 1998. ISSSE 98. 1998 URSI International Symposium on
  • Conference_Location
    Pisa
  • Print_ISBN
    0-7803-4900-8
  • Type

    conf

  • DOI
    10.1109/ISSSE.1998.738067
  • Filename
    738067