Embedded robustness IPs

Signal integrity has been pointed out as a major challenge. More and more causes can affect signal integrity as geometries are shrinking. One of the growing effects is the so-called "transient errors" which are due to temporary condition of use and environment. Cross-coupling, ground bounce, external terrestrial radiations create more and more unpredictable transient and soft errors which affect system reliability in unacceptable ways. In addition, reliability in devices like memories become a critical issue: the MTBF (mean time before failure) level decreasing the global system FIT (Failure in Time) rate approaching the critical border line for the end user. Hence, for memories and for logic blocks as well using high-end process technologies, self-correcting intelligence embedded in SoC is needed to enable electronic systems to react against unpredictable and insidious errors