Title :
Reliability study of MANOS with and without a SiO2 buffer layer and BE-MANOS charge-trapping NAND flash devices
Author :
Liao, Chien-Wei ; Lai, Sheng-Chih ; Lue, Hang-Ting ; Yang, Ming-Jui ; Shen, Chin-Yen ; Lue, Yi-Hsien ; Huang, Yu-Fong ; Hsieh, Jung-Yu ; Wang, Szu-Yu ; Luo, Guang-Li ; Chien, Chao-Hsin ; Hsieh, Kuang-Yeu ; Liu, Rich ; Lu, Chih-Yuan
Author_Institution :
Macronix Int. Co., Ltd., Hsinchu, Taiwan
Abstract :
The reliability of MANOS devices with an oxide buffer layer (MAONOS) in between SiN trapping layer and high-K Al2O3 top dielectric is extensively studied. We conclude that the primary function of high-K Al2O3 is to suppress the gate electron injection during erase instead of increasing the P/E speed. As a result, inserting a buffer oxide only changes EOT but does not change the P/E mechanisms. On the other hand, the buffer oxide can greatly improve data retention by suppressing leakage through Al2O3. However, owing to the slow erase performances with a thick bottom oxide, both MANOS and MAONOS erase slowly and very high erase voltages must be used. Also, both MANOS and MAONOS devices show very fast endurance degradation below P/E<10, which is inherent due to electron de-trapping mechanism. Moreover, the large erase voltage also causes severe degradation of tunnel oxide after many P/E cycling. To get both speed and reliability performances, it is necessary to introduce bandgap engineered tunneling barrier (BE-MANOS) to solve the fundamental problems of MANOS.
Keywords :
NAND circuits; buffer layers; flash memories; reliability; bandgap engineered tunneling barrier; buffer layer; charge-trapping NAND flash devices; oxide buffer layer; Buffer layers; Degradation; Dielectric devices; Electron traps; High K dielectric materials; High-K gate dielectrics; Photonic band gap; Reliability engineering; Silicon compounds; Voltage;
Conference_Titel :
VLSI Technology, Systems, and Applications, 2009. VLSI-TSA '09. International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4244-2784-0
Electronic_ISBN :
1524-766X
DOI :
10.1109/VTSA.2009.5159335