Title :
Roughness characterization of gate all around Silicon Nano Wire fabrication
Author :
Levi, Shimon ; Schwarzband, Ishai ; Kris, Roman ; Adan, Ofer
Author_Institution :
Appl. Mater. Israel, Rehovot, Israel
Abstract :
In this paper we present a new methodology to calibrate and correct in line roughness measurements for Silicon Nano Wires (SiNW) fabrication processes. For successful implementation of these processes in industry, the Silicon Nano Wires (SiNW) with widths of 5-25 nm should be characterized in the framework of Secondary Electron Microscope(CD SEM) Metrology. Different smoothing processes yield SiNWs with edge roughness values in the sub nanometer range[1]. Such small differences in roughness values provide an interesting opportunity to evaluate sensitivity of the SEM metrology algorithms and measurement accuracy. A simulation program modeling SEM images including small features was developed, taking into account the main factors that affect the SEM signal formation. Synthetic (simulated) images of SiNW in a range of 5-25 nm and roughness of 0-1 nm were produced. Using synthetic images with added Line Edge Roughness (LER), we characterized the performance and sensitivity of LER algorithms and CD metrics.
Keywords :
CMOS integrated circuits; electron microscopy; elemental semiconductors; nanofabrication; nanowires; semiconductor growth; silicon; smoothing methods; surface roughness; surface topography measurement; CD metrics; GAA; LER algorithm; SEM metrology algorithm; Si; SiNW; edge roughness value; gate all around; image synthesis; line edge roughness; measurement accuracy; nanofabrication; roughness measurement; secondary electron microscope; silicon nanowire; smoothing process; Accuracy; Mathematical model; Metrology; Noise; Numerical analysis; Scanning electron microscopy; Wires; CD SEM Metrology; Nanowires; Roughness; SEM Simulation;
Conference_Titel :
Electrical & Electronics Engineers in Israel (IEEEI), 2012 IEEE 27th Convention of
Conference_Location :
Eilat
Print_ISBN :
978-1-4673-4682-5
DOI :
10.1109/EEEI.2012.6376991