DocumentCode
2456254
Title
Improving compression ratio, area overhead, and test application time for system-on-a-chip test data compression/decompression
Author
Gonciari, Paul Theo ; Al-Hashimi, Bashir M. ; Nicolici, Nicola
Author_Institution
Dept. of Electron. & Comput. Sci., Southampton Univ., UK
fYear
2002
fDate
2002
Firstpage
604
Lastpage
611
Abstract
Proposes a new test data compression/decompression method for systems-on-a-chip. The method is based on analyzing the factors that influence test parameters: compression ratio, area overhead and test application time. To improve compression ratio, the new method is based on a variable-length input Huffman coding (VIHC), which fully exploits the type and length of the patterns, as well as a novel mapping and reordering algorithm proposed in a pre-processing step. The new VIHC algorithm is combined with a novel parallel on-chip decoder that simultaneously leads to low test application time and low area overhead. It is shown that, unlike three previous approaches which reduce some test parameters at the expense of the others, the proposed method is capable of improving all the three parameters simultaneously. An experimental comparison on benchmark circuits validates the proposed method
Keywords
Huffman codes; application specific integrated circuits; automatic testing; data compression; decoding; integrated circuit testing; logic testing; variable length codes; area overhead; benchmark circuits; compression ratio; data compression/decompression; mapping algorithm; parallel on-chip decoder; reordering algorithm; system-on-a-chip test data; test application time; variable-length input Huffman coding; Built-in self-test; Channel capacity; Circuit testing; Compression algorithms; Costs; Frequency; Huffman coding; System testing; System-on-a-chip; Test data compression;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe Conference and Exhibition, 2002. Proceedings
Conference_Location
Paris
ISSN
1530-1591
Print_ISBN
0-7695-1471-5
Type
conf
DOI
10.1109/DATE.2002.998363
Filename
998363
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