Title :
Hybrid spectral/intelligent modeling and decoupling control for a nonlinear distributed parameter system in IC packaging
Author :
Han-Xiong, Li ; Deng, H.
Author_Institution :
Dept. of MEEM, City Univ. of Hong Kong, China
Abstract :
An intelligence-based modeling method is proposed for the curing process, a nonlinear parabolic distributed parameter systems (DPSs). The proposed modeling method combines model reduction techniques and intelligence based identification methods of nonlinear ODE (ordinary differential equation) systems. The developed neural network model is of state space form and fits the general model-based controller formulations, so that the control techniques used for ODE models can be directly applied. Moreover an approximate decoupling-control is developed to replace PID controllers originally equipped for the cure process for a better cure performance.
Keywords :
curing; distributed parameter systems; integrated circuit packaging; neural nets; nonlinear control systems; nonlinear differential equations; observers; process control; reduced order systems; IC packaging; curing process; decoupling control; hybrid spectral model; intelligent model; model reduction techniques; neural network observer; nonlinear ODE; nonlinear distributed parameter system; Curing; Differential equations; Distributed parameter systems; Integrated circuit modeling; Integrated circuit packaging; Neural networks; Nonlinear control systems; Reduced order systems; State-space methods; Three-term control;
Conference_Titel :
Intelligent Control, 2004. Proceedings of the 2004 IEEE International Symposium on
Print_ISBN :
0-7803-8635-3
DOI :
10.1109/ISIC.2004.1387687