Smart IGBT model and its application for power converter design

Author

Kimata, Masahiro ; Koyama, Masato ; Uchida, Ryouhei ; Ikeda, Mikio ; Kawamura, Toshimi ; Okada, Takeo

Author_Institution

Ind. Electron. & Syst. Dev. Lab., Mitsubishi Electr. Corp., Hyogo, Japan

fYear

1994

fDate

2-6 Oct 1994

Firstpage

1168

Abstract

This paper proposes a novel IGBT model suitable for analyzing the static and dynamic switching characteristics of IGBT modules, which are widely used in power converter circuits. This model is a subcircuit model derived from the basic IGBT equivalent circuit, and can be implemented in the circuit simulator SPICE without modifying the simulator codes nor using user-defined subroutines. Model parameters are easily extracted from measured electrical characteristics of IGBT modules. The validity of this model is confirmed by experimental results. Some simulation results are also presented to indicate the availability of this IGBT model for accurately estimating the performance of power converters and for designing their robust snubber protection circuits

Keywords

SPICE; bipolar transistor switches; circuit CAD; circuit analysis computing; digital simulation; equivalent circuits; insulated gate bipolar transistors; power bipolar transistors; power convertors; power engineering computing; power semiconductor switches; semiconductor device models; snubbers; switching circuits; IGBT model; SPICE; availability; circuit design; dynamic switching characteristics; electrical characteristics; equivalent circuit; performance; power converter; robust snubber protection circuits; simulator codes; static switching characteristics; subcircuit model; Algorithms; Circuit simulation; Electric variables; Electric variables measurement; Equivalent circuits; Insulated gate bipolar transistors; SPICE; Static power converters; Switching circuits; Switching converters;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Society Annual Meeting, 1994., Conference Record of the 1994 IEEE

Conference_Location

Denver, CO

Print_ISBN

0-7803-1993-1

Type

conf

DOI

10.1109/IAS.1994.377576

Filename

377576