• DocumentCode
    2456692
  • Title

    Thyristor (diode) transient thermal impedance modeling and verification for inductive load applications

  • Author

    Motto, John W., Jr.

  • Author_Institution
    Powerix Inc., Youngwood, PA, USA
  • fYear
    1994
  • fDate
    2-6 Oct 1994
  • Firstpage
    1277
  • Abstract
    Circuit modeling is an essential tool in the design of power electronic applications. The necessity of these models to be closely connected to the manufacturers´ specifications and rating systems is self-evident. This paper addresses one of the most difficult parameters of thyristor and diode modeling; that of transient thermal impedance. The development of a model from the device physical dimensions and materials is described, along with how the transient solution of this thermal equivalent circuit can be obtained via PSPICE. To arrive at the simple four or five term equivalent circuit for modeling, a nonlinear regression method is described. This model is then verified against the ratings calculated with the STARS rating program for large area thyristor inductive load applications. The resulting simple series equivalent thermal circuit will permit design engineers to hard code and use SPICE circuit modeling to monitor the waveform of virtual junction temperature of the thyristor or diode in the proposed application
  • Keywords
    SPICE; circuit analysis computing; digital simulation; equivalent circuits; power electronics; semiconductor device models; semiconductor diodes; thermal analysis; thyristors; transient analysis; PSPICE; STARS rating program; THZDEV program; circuit modeling; diode; inductive load applications; nonlinear regression method; power electronic applications; thermal equivalent circuit; thyristor; transient thermal impedance modeling; virtual junction temperature; waveform monitoring; Design engineering; Diodes; Equivalent circuits; Impedance; Power electronics; Power system modeling; SPICE; Thermal engineering; Thyristors; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Society Annual Meeting, 1994., Conference Record of the 1994 IEEE
  • Conference_Location
    Denver, CO
  • Print_ISBN
    0-7803-1993-1
  • Type

    conf

  • DOI
    10.1109/IAS.1994.377583
  • Filename
    377583