• DocumentCode
    2456856
  • Title

    Power semiconductor devices-examination of subcycle surge current ratings as needed for fuse selection

  • Author

    Eriksson, L.O. ; Piccone, D.E. ; Willinger, L.J. ; Tobin, W.H.

  • Author_Institution
    Silicon Power Corp., Malvern, PA, USA
  • fYear
    1994
  • fDate
    2-6 Oct 1994
  • Firstpage
    1329
  • Abstract
    It is well recognized that subcycle Irms2t ratings for high power semiconductor devices and current limiting fuses are not equivalent because the former are based on single half sine waves while the latter are based on near triangular waves as associated with current interruption. Also the difference becomes more pronounced for thyristors as opposed to rectifier diodes due to the finite spreading rate of the turned on region which produces additional heating effects. Although the published characteristics and application data from fuse manufacturers are usually adequate, the circuit designer may find difficulty applying this information to that of the power semiconductor device. This paper examines concepts for determining reliable subcycle surge ratings including proof testing the highest power “state of the art” thyristors and makes recommendation for improvement and economizing of testing
  • Keywords
    current limiters; electric fuses; overcurrent protection; power semiconductor devices; semiconductor device testing; surge protection; current interruption; current limiting fuses; finite spreading rate; fuse selection; half sine waves; power semiconductor devices; proof testing; rectifier diodes; state of the art; subcycle Irms2t ratings; subcycle surge current ratings; thyristors; triangular waves; turned on region; Circuit testing; Current limiters; Fuses; Heating; Power semiconductor devices; Rectifiers; Semiconductor device manufacture; Semiconductor diodes; Surges; Thyristors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Society Annual Meeting, 1994., Conference Record of the 1994 IEEE
  • Conference_Location
    Denver, CO
  • Print_ISBN
    0-7803-1993-1
  • Type

    conf

  • DOI
    10.1109/IAS.1994.377593
  • Filename
    377593