• DocumentCode
    2458333
  • Title

    A new on-wafer de-embedding technique for on-chip rf transmission line interconnect characterization

  • Author

    Tretiakov, Yuri ; Woods, Walt ; Venkatadri, Swathi ; Zwick, T.

  • fYear
    2004
  • fDate
    38149
  • Firstpage
    69
  • Lastpage
    72
  • Keywords
    Admittance measurement; Impedance; Integrated circuit interconnections; Integrated circuit measurements; Integrated circuit modeling; Radio frequency; Scattering parameters; Testing; Transmission line measurements; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest Spring, 2004. 63rd
  • Print_ISBN
    0-7803-8371-0
  • Type

    conf

  • DOI
    10.1109/ARFTG.2004.1387857
  • Filename
    1387857
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2458333