• DocumentCode
    2458780
  • Title

    An integrated approach to power electronics systems

  • Author

    Lee, Fred C. ; Van Wyk, J. Daan ; Boroyevich, Dushan ; Barbosa, Peter

  • Author_Institution
    Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
  • Volume
    1
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    7
  • Abstract
    Power electronics systems are typically designed and manufactured using nonstandard parts, which results in labor-intensive manufacturing processes and increased cost. As a possible way to overcome these problems, this paper provides an overview of an integrated approach to design and realize power electronics systems, aiming at improved performance, reliability, manufacturability and cost effectiveness. A brief discussion is presented on the technology barriers that limit the rapid growth of power electronics, such as passive components and packaging techniques. It is also discussed the technology advancements needed to improve the characteristics of power electronics systems, such as increased levels of integration, standardization of parts and improved packaging techniques for enhanced thermal management and electrical performance. The technologies being developed for the realization of integrated systems include planar metalization to allow three-dimensional structural integration of power devices and control functions, integration of power passives, and integration of electrical/thermal design tools
  • Keywords
    manufacturing processes; packaging; power electronics; control functions; cost effectiveness; electrical performance; integrated approach; manufacturability; manufacturing processes; packaging techniques; passive components; performance; planar metalization; power devices; power electronics systems; reliability; standardization; technology barriers; thermal management; three-dimensional structural integration; Components, packaging, and manufacturing technology; Costs; Electronic packaging thermal management; Energy management; Manufacturing processes; Power electronics; Power system reliability; Pulp manufacturing; Standardization; Thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Conversion Conference, 2002. PCC-Osaka 2002. Proceedings of the
  • Conference_Location
    Osaka
  • Print_ISBN
    0-7803-7156-9
  • Type

    conf

  • DOI
    10.1109/PCC.2002.998503
  • Filename
    998503