DocumentCode
2460013
Title
Boron retarded diffusion in the presence of indium or germanium
Author
Hong-Jyh Li ; Kirichenko, T.A. ; Kohli, Pushmeet ; Banerjee, Sanjay K. ; Graetz, E. ; Tichy, R. ; Zeitzoff, Peter
fYear
2002
fDate
27-27 Sept. 2002
Firstpage
25
Lastpage
28
Abstract
Experimental results of Ge and In pre-amorphization by ion implantation show that the diffusion of B is retarded by the presence of Ge or In, and that this retardation is more important than the pre-amorphization (de-channeling) effect. Result shows that In retards B diffusion more than Ge, and the retardation effect due to In becomes greater with increasing retained dose of In. Larger In doses cause larger strain, which results in more B being tied up in immobile clusters near the surface. In order to achieve adequate retained dose of In, the implanted dose of In must be increased to 5×1015 cm-2. After anneal, the junction depth (at 1018 cm-3) is reduced from 628 Å in the control wafer (no In co-implant) to 480 Å.
Keywords
CMOS integrated circuits; amorphisation; annealing; boron; diffusion; germanium; indium; ion implantation; semiconductor doping; 480 Å; 628 Å; B retarded diffusion; Ge pre-amorphization; In pre-amorphization; de-channeling; ion implantation; Bonding; Boron; Capacitive sensors; Diffusion processes; Germanium; Implants; Indium; Ion implantation; Microelectronics; Rapid thermal annealing;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location
Taos, New Mexico, USA
Print_ISBN
0-7803-7155-0
Type
conf
DOI
10.1109/IIT.2002.1257929
Filename
1257929
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