• DocumentCode
    2461974
  • Title

    High-Speed CMOS Chip Design for Manchester and Miller Encoder

  • Author

    Hung, Yu-Cherng ; Kuo, Min-Ming ; Tung, Chiou-Kou ; Shieh, Shao-Hui

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chinyi Univ. of Technol., Taichung, Taiwan
  • fYear
    2009
  • fDate
    12-14 Sept. 2009
  • Firstpage
    538
  • Lastpage
    541
  • Abstract
    In this paper, we propose a modified Manchester and Miller encoder that can operate in high frequency without a sophisticated circuit structure. Based on the previous proposed architecture, the study has adopted the concept of parallel operation to improve data throughput. In addition, the technique of hardware sharing is adopted in this design to reduce the number of transistors. The study uses TSMC CMOS 0.35-mum 2P4M technology. The simulation result of HSPICE indicates that it functions successfully and works at 200-MHz speed. The average power consumption of the circuit under room temperature is 549 muW. The total core area is 70.7 mumtimes72.2 mum. As expected, the circuit can be easily integrated into radio frequency identification (RFID) application.
  • Keywords
    CMOS integrated circuits; SPICE; UHF devices; radiofrequency identification; HSPICE simulation; Manchester encoder; Miller encoder; TSMC CMOS 2P4M technology; average power consumption; frequency 200 MHz; hardware sharing technique; high-speed CMOS chip design; parallel operation; power 549 muW; radio frequency identification application; size 0.35 mum; size 70.7 mum; size 72.2 mum; sophisticated circuit structure; temperature 293 K to 298 K; transistors; CMOS technology; Chip scale packaging; Circuit simulation; Energy consumption; Frequency; Hardware; Integrated circuit technology; Radiofrequency identification; Temperature; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Information Hiding and Multimedia Signal Processing, 2009. IIH-MSP '09. Fifth International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4244-4717-6
  • Electronic_ISBN
    978-0-7695-3762-7
  • Type

    conf

  • DOI
    10.1109/IIH-MSP.2009.62
  • Filename
    5337351