DocumentCode
2463064
Title
Aging test results for high temperature TRIACs during power cycling
Author
Jacques, Sébastien ; Batut, Nathalie ; Leroy, René ; Gonthier, Laurent
Author_Institution
Power Microelectron. Lab., Tours Univ., Tours
fYear
2008
fDate
15-19 June 2008
Firstpage
2447
Lastpage
2452
Abstract
This paper deals with the functional reliability study of a new 16 A - 600 V high-temperature TRIAC family, subjected to power cycles, simulating the component in harsh real operation conditions. The targeted application is a vacuum cleaner (1800 W - 230 V - 50 Hz). In this kind of application, one of the major issues for TRIAC, which leads to high mechanical stresses for the assembly, occurs when the switch turns-on in ldquojammed nozzle operationrdquo, i.e. when the tube is blocked. In that case, the TRIAC junction temperature reaches at most 180degC, higher than the maximum value specified by the manufacturer (i.e. 150degC). The aim of this study is to evaluate the TRIACs lifetime under these operation conditions. The thermal stresses generate local temperature variations and then, some mechanical stresses (assembly degradation). For TRIACs, the junction-to-case thermal resistance (Rth(j-c)) increase is the signature of such a damage. The lifetime has been studied and fitted with a Lognormale distribution. The components damages, due to the mechanical stresses, have been explained thanks to some qualitative two-dimensional thermo-mechanical simulations using finite elements (ANSYSreg).
Keywords
circuit reliability; domestic appliances; finite element analysis; log normal distribution; thyristors; ANSYS; Lognormale distribution; TRIAC junction temperature; aging test results; assembly degradation; current 16 A; finite elements; frequency 50 Hz; functional reliability; high temperature TRIAC; jammed nozzle operation; junction-to-case thermal resistance; mechanical stresses; power 1800 W; power cycling; temperature 180 C; two-dimensional thermo-mechanical simulations; vacuum cleaner; voltage 230 V; voltage 600 V; Aging; Assembly; Manufacturing; Switches; Temperature; Testing; Thermal degradation; Thermal resistance; Thermal stresses; Thyristors;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Specialists Conference, 2008. PESC 2008. IEEE
Conference_Location
Rhodes
ISSN
0275-9306
Print_ISBN
978-1-4244-1667-7
Electronic_ISBN
0275-9306
Type
conf
DOI
10.1109/PESC.2008.4592308
Filename
4592308
Link To Document