Title :
Towards multiscale systems modeling of endocardial to mesenchymal transition
Author :
Abdulla, Tariq ; Imms, Ryan A. ; Schleich, Jean-Marc ; Summers, Ron
Author_Institution :
Electronic and Electrical Engineering Department, Loughborough University, UK
fDate :
Aug. 30 2011-Sept. 3 2011
Abstract :
Cell behavior during endocardial to mesenchymal transition (EMT) was simulated using the cellular Potts formalism in Compucell 3D. The processes of loss of endocardial cohesion and invasion into the extracellular matrix (ECM) were stimulated by changing surface energy parameters. The simulations match in vitro results which suggest that endocardial motility on the surface of collagen gel can be induced separately from 3D invasion of the gel, via Notch signaling in the absence of BMP2. A principle by which the rate of mitosis would regulate the monolayer was demonstrated; suggesting a route for Vascular Endothelial Growth Factor (VEGF) control of EMT. A conceptual model of the system of protein interactions during EMT was assembled from multiple studies. A route for subcellular models to be formalized as Systems Biology Markup Language (SBML) differential equations is indicated. Scale linking would be achieved through Compucell 3D periodically integrating the SBML models for each cell during a simulation run, and updating parameters for protein concentrations assigned to individual cells. The surface energy parameters for the cells would be recalculated at each step from their simulated protein concentrations. Such scale linking opens up the potential for complexity to be gradually introduced, while maintaining experimental validation.
Keywords :
Adhesives; Biological system modeling; Electronic countermeasures; Heart; In vitro; Proteins; Valves; Animals; Cell Differentiation; Computer Simulation; Endocardium; Extracellular Matrix; Extracellular Matrix Proteins; Humans; Mesenchymal Stromal Cells; Models, Cardiovascular; Receptors, Notch;
Conference_Titel :
Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-4121-1
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2011.6090062