New opportunities in vacuum electronics through the application of microfabrication technologies

Author

Booske, John H.

Author_Institution

Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA

fYear

2002

fDate

2002

Firstpage

11

Lastpage

12

Abstract

Recent developments in microfabrication technologies have produced a portfolio of methods to batch fabricate three-dimensional, micro-scale structures. This has opened the door to new and exciting possibilities in vacuum electronics technology. Application of these modern microfabrication techniques to vacuum electronics now offers new prospects, including: (1) improved device efficiency by replacing thermionic cathodes with micro-fabricated field emitter cathodes, (2) reliable, precise fabrication of miniature millimeter and submillimeter wave circuits, (3) high yields and lower component costs due to batch fabrication, and (4) greater integration which can reduce piece parts assembly, increase yields, and decrease costs.

Keywords

vacuum microelectronics; batch fabrication; field emitter cathode; microfabrication technology; millimeter wave circuit; submillimeter wave circuit; three-dimensional structure; vacuum electronics; Cathodes; Costs; Fabrication; Integrated circuit reliability; Millimeter wave devices; Millimeter wave technology; Portfolios; Submillimeter wave circuits; Submillimeter wave technology; Vacuum technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Vacuum Electronics Conference, 2002. IVEC 2002. Third IEEE International

Print_ISBN

0-7803-7256-5

Type

conf

DOI

10.1109/IVELEC.2002.999234

Filename

999234