DocumentCode
2465770
Title
Temperature estimation of semiconductor die heating using numerical techniques in real time
Author
Thomas, K.P. ; Webb, P.W.
Author_Institution
Smiths Ind. Aerosp. Ltd., UK
fYear
1997
fDate
35459
Firstpage
42522
Lastpage
42527
Abstract
This paper first details many of the practical difficulties associated with the temperature measurement of a power semiconductor die housed within a commercial package. The paper then goes on to describe a method of protection which is based on predicting the die temperature in real time by the use of a numerical model continuously calculated on a low cost microprocessor
Keywords
power semiconductor devices; die temperature; microprocessor; numerical technique; package; power semiconductor; protection; real time simulation; thermal model;
fLanguage
English
Publisher
iet
Conference_Titel
Modelling and Simulation for Thermal Management (Digest No. 1997/043), IEE Colloquium on
Conference_Location
London
Type
conf
DOI
10.1049/ic:19970271
Filename
668301
Link To Document