Title :
Temperature estimation of semiconductor die heating using numerical techniques in real time
Author :
Thomas, K.P. ; Webb, P.W.
Author_Institution :
Smiths Ind. Aerosp. Ltd., UK
Abstract :
This paper first details many of the practical difficulties associated with the temperature measurement of a power semiconductor die housed within a commercial package. The paper then goes on to describe a method of protection which is based on predicting the die temperature in real time by the use of a numerical model continuously calculated on a low cost microprocessor
Keywords :
power semiconductor devices; die temperature; microprocessor; numerical technique; package; power semiconductor; protection; real time simulation; thermal model;
Conference_Titel :
Modelling and Simulation for Thermal Management (Digest No. 1997/043), IEE Colloquium on
Conference_Location :
London
DOI :
10.1049/ic:19970271
