DocumentCode :
2466005
Title :
Reliability characteristics of W-La2O3 structures compared with those of HfO2-based gate oxides
Author :
Molina, J. ; De La Hidalga, F.J. ; Rosales, P. ; Kakushima, K. ; Ahmet, P. ; Tsutsui, K. ; Sugii, N. ; Hattori, T. ; Iwai, H.
Author_Institution :
Dept. of Electron., Nat. Inst. of Astrophys., Puebla
fYear :
2008
fDate :
8-10 Dec. 2008
Firstpage :
1
Lastpage :
4
Abstract :
In this paper, we report and compare the reliability results obtained for W-La2O3 gated Metal-Oxide-Semiconductor (MOS) devices with those of HfO2-based systems reported in literature. Reliability issues like stress-induced leakage current (SILC), interface-states generation (Dit), threshold voltage shift (DeltaVth) and time to breakdown (tbd) were compared and analyzed for both dielectrics in order to obtain a more specific assessment of their resistance to electrical degradation and breakdown.
Keywords :
MIS devices; dielectric thin films; hafnium compounds; interface states; lanthanum compounds; leakage currents; semiconductor device breakdown; semiconductor device reliability; tungsten; HfO2; W-La2O3; electrical breakdown; electrical degradation; gated metal-oxide-semiconductor devices; interface-states generation; reliability; resistance; stress-induced leakage current; threshold voltage shift; Annealing; Degradation; Dielectric breakdown; Dielectric substrates; Electric variables; Hafnium oxide; High K dielectric materials; Leakage current; MOS devices; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices and Solid-State Circuits, 2008. EDSSC 2008. IEEE International Conference on
Conference_Location :
Hong Kong
Print_ISBN :
978-1-4244-2539-6
Electronic_ISBN :
978-1-4244-2540-2
Type :
conf
DOI :
10.1109/EDSSC.2008.4760658
Filename :
4760658
Link To Document :
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