DocumentCode
2468119
Title
Drop simulation of molded cushion for Largr-size LCD
Author
Li, Wenbiao ; Wu, Xiaoming
Author_Institution
Department of Mechaical and Electrical Engineering, Xiamen University, China
fYear
2011
fDate
24-26 June 2011
Firstpage
5884
Lastpage
5887
Abstract
A drop simulation about the Large-size LCD molded cushion was implemented with the standard of drop height and fragility using ANSYS/LS-DYNA. The peak ground acceleration and the stress was achieved from the analysis. The molded pulp cushion was optimized and a reasonable project was designed using the data.
Keywords
Analytical models; Design automation; Finite element methods; Packaging; Paper pulp; Solid modeling; TV; cushion packaging; drop impact; finite element simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Remote Sensing, Environment and Transportation Engineering (RSETE), 2011 International Conference on
Conference_Location
Nanjing, China
Print_ISBN
978-1-4244-9172-8
Type
conf
DOI
10.1109/RSETE.2011.5965693
Filename
5965693
Link To Document