Detection of Localized Adhesive Failure of Metallization on Non-Conducting Substrates Using Electromagnetic Ultrasonic Generation

Author

Imaino, W. ; Crawforth, L. ; Munce, A.C. ; Juliana, A.

fYear

1986

fDate

17-19 Nov. 1986

Firstpage

1065

Lastpage

1070

Keywords

Adhesives; Area measurement; Bonding; Circuit testing; Delamination; Impedance; Metallization; Pollution measurement; Pulse measurements; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

IEEE 1986 Ultrasonics Symposium

Conference_Location

Williamsburg, VA, USA

Type

DOI

10.1109/ULTSYM.1986.198900

Filename

1535840

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