2E-2 0806 SAW Filters Using Wafer Level Packaging Technology

Author

Fukano, Toru ; Okubo, Yoshihiro ; Nishii, Junya ; Obara, Ikuo

Author_Institution

Kyocera Corp., Kyoto

fYear

2007

fDate

28-31 Oct. 2007

Firstpage

68

Lastpage

71

Abstract

Very small SAW filters of the size 0.8 mm x 0.6 mm based on wafer-level packaging technology are fabricated and tested. Excellent electrical performance as well as robustness against humidity and mechanical stress are demonstrated. Complete devices are fabricated on a wafer, instead of bonding with a ceramic substrate or another wafer. A structure with a hollow space is built on the piezoelectric substrate by semiconductor processes in order to allow the surface acoustic waves to freely propagate without any loss. Either LGA or BGA type of terminals are available with the filter. It is demonstrated that the developed WLP SAW filters are suitable for use in high-performance RF front-end modules.

Keywords

ball grid arrays; piezoelectric materials; surface acoustic wave filters; ultrasonic devices; wafer level packaging; 0806 SAW filters; BGA terminal type; LGA terminal type; SAW filter electrical performance; SAW filter robustness; WLP SAW filter; ball grid array; high performance RF front end module; humidity; land grid array; mechanical stress; piezoelectric substrate; size 0.6 mm; size 0.8 mm; small SAW filter; surface acoustic wave propagation; wafer level packaging technology; Ceramics; Humidity; Robustness; SAW filters; Space technology; Stress; Substrates; Testing; Wafer bonding; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 2007. IEEE

Conference_Location

New York, NY

ISSN

1051-0117

Print_ISBN

978-1-4244-1384-3

Electronic_ISBN

1051-0117

Type

conf

DOI

10.1109/ULTSYM.2007.30

Filename

4409603