Title :
2F-5 Surface Preparation of 1-3 Piezocomposite Material for Microfabrication of High Frequency Transducer Arrays
Author :
Bernassau, A.L. ; McKay, S. ; Hutson, D. ; Demoré, C. E M ; Garcia-Gancedo, L. ; Button, T.W. ; McAneny, J.J. ; Cochran, S.
Author_Institution :
Univ. of Dundee, Dundee
Abstract :
A key issue in the development of ultrasound imaging arrays to operate at frequencies above 30 MHz is the need for photolithographic patterning of array electrodes. To achieve this directly on a 1-3 piezocomposite requires planar, parallel and smooth surfaces. This paper reports an investigation of the surface finishing of 1-3 piezocomposite material by mechanical lapping and/polishing that has demonstrated that excellent surface flatness can be obtained. Subsequently, high frequency array elements have been fabricated on these surfaces using a low temperature lift-off photolithography process. A 50 MHz linear array with 30 mum element pitch has been patterned on the lapped and polished surface of a low frequency 1-3 piezocomposite. Good electrode edge definition and electrical contact to the composite were obtained. Additionally, patterning has been demonstrated on a fine-scale composite, itself suitable for operation above 30 MHz.
Keywords :
biomedical ultrasonics; composite materials; micromachining; photolithography; piezoelectric materials; polishing; surface finishing; ultrasonic imaging; ultrasonic transducer arrays; array electrodes; electrical contact; electrode edge definition; frequency 50 MHz; high frequency transducer arrays; low temperature lift-off photolithography process; mechanical lapping; medical imaging; micro fabrication; photolithographic patterning; piezocomposite material; polishing; size 30 mum; surface finishing; surface flatness; surface preparation; ultrasound imaging arrays; Contacts; Electrodes; Frequency; Lapping; Lithography; Surface finishing; Temperature; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers;
Conference_Titel :
Ultrasonics Symposium, 2007. IEEE
Conference_Location :
New York, NY
Print_ISBN :
978-1-4244-1384-3
Electronic_ISBN :
1051-0117
DOI :
10.1109/ULTSYM.2007.37