Title :
Variation-aware analysis: savior of the nanometer era?
Author :
Joyner, William H. ; Rawat, Shishpal ; Nassif, Sani R. ; Pitchumani, Vijay ; Rodriguez, Norma ; Sylvester, Dennis ; Bittlestone, Olive ; Radojcic, Riko
Abstract :
VLSI engineers have traditionally used a variety of CAD analysis tools (e.g. SPICE) to deal with variability. As we go into deep sub micron issues, the analysis is becoming harder due to many secondary effects becoming primary. Panelists will debate the variability trend and present the order of importance of many variability trends (Vdd, Vt, interconnect, Leff, gate width) and their impact on design tools and methodologies. What new design tools, new modeling methodologies, and new (or old) design styles will combine to address variability? Will conservative design to accommodate variability halt the progress of Moore´s law? Is life as we know it over, or are we facing an opportunity for innovation in tools and design that will move us forward over the barriers that technology has placed in our path?
Keywords :
VLSI; circuit layout CAD; integrated circuit design; integrated circuit yield; CAD analysis tools; Moore law; VLSI; integrated circuit design; integrated circuit yield; variability trends; Circuit optimization; Design methodology; Geometry; Instruments; Integrated circuit interconnections; Investments; Process design; SPICE; Stress; Very large scale integration; DFY; Design; Performance; Variability; Verification; Yield;
Conference_Titel :
Design Automation Conference, 2006 43rd ACM/IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
1-59593-381-6
DOI :
10.1109/DAC.2006.229216