• DocumentCode
    2470498
  • Title

    Gear incipient fault prognosis using Density-adjustable Spectral Clustering and Transductive SVM

  • Author

    Huan Yin ; Weihua Li

  • Author_Institution
    Sch. of Mech. & Automotive Eng., South China Univ. of Technol., Guangzhou, China
  • fYear
    2012
  • fDate
    23-25 May 2012
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    A novel method is presented in this paper, which using Density-adjustable Spectral Clustering and Transductive Support Vector Machine, called DSTSVM, to accomplish feature extraction and fault detection. Firstly, the features are extracted via Density-adjustable Spectral clustering, and the Kernel function of TSVM (Transductive Support Vector Machine) is also constructed. Then the TSVM is trained by gradient descent learning and applied in gear failure detection. Gear fault experiments were conducted on an automobile transmission tests platform, and the proposed method were compared with those using TSVM, CKSVM (Cluster Kernel). Experiments results indicated that the proposed approach can reflect the data structure well, and has high classification accuracy with few labeled data.
  • Keywords
    failure analysis; fault diagnosis; feature extraction; gears; gradient methods; learning (artificial intelligence); mechanical engineering computing; mechanical testing; pattern clustering; power transmission (mechanical); support vector machines; CKSVM; DSTSVM; Kernel function; automobile transmission test platform; cluster kernel support vector machine; density-adjustable spectral clustering; fault detection; feature extraction; gear failure detection; gear fault experiments; gear incipient fault prognosis; gradient descent learning; transductive SVM; transductive support vector machine; Kernel; Optical sensors; Support vector machine classification; Gear; Incipient Fault Prognosis; Spectral Clustering; TSVM;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Prognostics and System Health Management (PHM), 2012 IEEE Conference on
  • Conference_Location
    Beijing
  • ISSN
    2166-563X
  • Print_ISBN
    978-1-4577-1909-7
  • Electronic_ISBN
    2166-563X
  • Type

    conf

  • DOI
    10.1109/PHM.2012.6228905
  • Filename
    6228905