Title :
Computation of accurate interconnect process parameter values for performance corners under process variations
Author :
Huebbers, Frank ; Dasdan, Ali ; Ismail, Yehea
Author_Institution :
Dept. of EECS, Northwestern Univ., Evanston, IL
Abstract :
This paper introduces a fast analytical model for determining accurate parasitic values for best- and worst-case delays of a stage under interconnect process variations. The inputs to the model are the nominal values for each interconnect and device parameter and the amount of variation in each interconnect parameter. The outputs of the model are the interconnect parameter dimensions within the range of process variation that yield the best- and worst-case delay of a stage. Simulations show that our model accurately predicts the performance corners of a stage while those predicted by traditional best/worst-case analysis methodologies can have an error of up to 28.42%
Keywords :
delays; integrated circuit interconnections; semiconductor process modelling; interconnect parameter dimensions; interconnect process parameter values; interconnect process variations; Analytical models; Clocks; Context modeling; Delay; Hardware; Integrated circuit interconnections; Manufacturing processes; Performance analysis; Predictive models; Timing; Corners; Delay; Interconnect; Performance; Reliability; STA; Variations; Verification;
Conference_Titel :
Design Automation Conference, 2006 43rd ACM/IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
1-59593-381-6
DOI :
10.1109/DAC.2006.229326