• DocumentCode
    2471386
  • Title

    Computation of accurate interconnect process parameter values for performance corners under process variations

  • Author

    Huebbers, Frank ; Dasdan, Ali ; Ismail, Yehea

  • Author_Institution
    Dept. of EECS, Northwestern Univ., Evanston, IL
  • fYear
    0
  • fDate
    0-0 0
  • Firstpage
    797
  • Lastpage
    800
  • Abstract
    This paper introduces a fast analytical model for determining accurate parasitic values for best- and worst-case delays of a stage under interconnect process variations. The inputs to the model are the nominal values for each interconnect and device parameter and the amount of variation in each interconnect parameter. The outputs of the model are the interconnect parameter dimensions within the range of process variation that yield the best- and worst-case delay of a stage. Simulations show that our model accurately predicts the performance corners of a stage while those predicted by traditional best/worst-case analysis methodologies can have an error of up to 28.42%
  • Keywords
    delays; integrated circuit interconnections; semiconductor process modelling; interconnect parameter dimensions; interconnect process parameter values; interconnect process variations; Analytical models; Clocks; Context modeling; Delay; Hardware; Integrated circuit interconnections; Manufacturing processes; Performance analysis; Predictive models; Timing; Corners; Delay; Interconnect; Performance; Reliability; STA; Variations; Verification;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference, 2006 43rd ACM/IEEE
  • Conference_Location
    San Francisco, CA
  • ISSN
    0738-100X
  • Print_ISBN
    1-59593-381-6
  • Type

    conf

  • DOI
    10.1109/DAC.2006.229326
  • Filename
    1688904