DocumentCode
2471386
Title
Computation of accurate interconnect process parameter values for performance corners under process variations
Author
Huebbers, Frank ; Dasdan, Ali ; Ismail, Yehea
Author_Institution
Dept. of EECS, Northwestern Univ., Evanston, IL
fYear
0
fDate
0-0 0
Firstpage
797
Lastpage
800
Abstract
This paper introduces a fast analytical model for determining accurate parasitic values for best- and worst-case delays of a stage under interconnect process variations. The inputs to the model are the nominal values for each interconnect and device parameter and the amount of variation in each interconnect parameter. The outputs of the model are the interconnect parameter dimensions within the range of process variation that yield the best- and worst-case delay of a stage. Simulations show that our model accurately predicts the performance corners of a stage while those predicted by traditional best/worst-case analysis methodologies can have an error of up to 28.42%
Keywords
delays; integrated circuit interconnections; semiconductor process modelling; interconnect parameter dimensions; interconnect process parameter values; interconnect process variations; Analytical models; Clocks; Context modeling; Delay; Hardware; Integrated circuit interconnections; Manufacturing processes; Performance analysis; Predictive models; Timing; Corners; Delay; Interconnect; Performance; Reliability; STA; Variations; Verification;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference, 2006 43rd ACM/IEEE
Conference_Location
San Francisco, CA
ISSN
0738-100X
Print_ISBN
1-59593-381-6
Type
conf
DOI
10.1109/DAC.2006.229326
Filename
1688904
Link To Document