Reliability assessment for a double-sided cooling power electronics module

The reliability assessment for a 10 kV, wire-bondless power electronics module with a double-sided cooling was investigated. A direct solder attachment was employed to minimize parasitic circuit elements and increase current handling capability as well as to enable double-sided cooling capability with mechanical robustness. Finite element simulations were performed to investigate the reliability of the power module in terms of the thermal, electrical and mechanical performance. To further enhance the high-voltage reliability, a polyamide imide (PAI) nano material as a high-voltage passivation was employed. Wire bondless power modules have been fabricated and passivated using the PAI hybrid nano material. These power modules were tested up to 10 kV.